NDS356AP Generic image

NDS356AP

Part No
NDS356AP
Manufacturer
onsemi
Description
Dissipation Pd:500mW; Pulse Current Idm:10A; SMD Marking:NDS356AP; Tape Width:8mm; Termination Type:SMD; Voltage Vgs th Max:-2.5V
Datasheet
NDS356AP
Test Report
Available
Samples
Available

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    Product Specification

    Specification Value
    Continuous Drain Current (ID) 1.1 A
    Current Rating -1.1 A
    Drain to Source Breakdown Voltage -30 V
    Drain to Source Resistance 200 mΩ
    Drain to Source Voltage (Vdss) -30 V
    Dual Supply Voltage -30 V
    Element Configuration Single
    Fall Time 17 ns
    Gate to Source Voltage (Vgs) 20 V
    Input Capacitance 280 pF
    Max Junction Temperature (Tj) 150 °C
    Max Operating Temperature 150 °C
    Max Power Dissipation 500 mW
    Min Breakdown Voltage 30 V
    Min Operating Temperature -55 °C
    Nominal Vgs -2 V
    Number of Channels 1
    Number of Elements 1
    Packaging Cut Tape
    Power Dissipation 500 mW
    Rds On Max 200 mΩ
    Resistance 300 mΩ
    Rise Time 17 ns
    Schedule B 8541210080, 8541210080|8541210080|8541210080|8541210080|8541210080
    Termination SMD/SMT
    Turn-Off Delay Time 53 ns
    Turn-On Delay Time 8 ns
    Voltage Rating (DC) -30 V
    Case/Package SOT-23-3
    Mount Surface Mount
    Number of Pins 3
    Number of Terminals 3
    Weight 30 mg
    Height 1.12 mm
    Width 3.05 mm
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