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H11L1SR2M
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Product Specification
| Specification | Value |
|---|---|
| Data Rate | 1 Mbps |
| Direction | Unidirectional |
| Fall Time | 100 ns |
| Forward Current | 60 mA |
| Forward Voltage | 1.2 V |
| Frequency | 1 MHz |
| Input Current | 10 mA |
| Isolation Voltage | 7.5 kV |
| Max Collector Current | 5 mA |
| Max Frequency | 1 MHz |
| Max Junction Temperature (Tj) | 125 °C |
| Max Operating Temperature | 85 °C |
| Max Output Current | 50 mA |
| Max Output Voltage | 16 V |
| Max Power Dissipation | 150 mW |
| Max Supply Voltage | 15 V |
| Min Operating Temperature | -40 °C |
| Min Supply Voltage | 3 V |
| Number of Channels | 1 |
| Number of Circuits | 1 |
| Number of Elements | 1 |
| Operating Supply Voltage | 16 V |
| Output Current | 50 mA |
| Output Current per Channel | 50 mA |
| Output Voltage | 16 V |
| Packaging | Cut Tape |
| Power Dissipation | 250 mW |
| Propagation Delay | 4 µs |
| Reverse Breakdown Voltage | 6 V |
| Reverse Voltage | 6 V |
| Reverse Voltage (DC) | 6 V |
| Rise Time | 100 ns |
| Schedule B | 8541408000, 8541408000|8541408000, 8541408000|8541408000|8541408000, 8541408000|8541408000|8541408000|8541408000 |
| Turn-Off Delay Time | 1.2 µs |
| Turn-On Delay Time | 1 µs |
| Case/Package | PDIP |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Number of Pins | 6 |
| Weight | 810 mg |
| Height | 4.8 mm |
| Length | 8.89 mm |
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